Ludzie pragną czasami się rozstawać, żeby móc tęsknić, czekać i cieszyć się z powrotem.
3
pC typ
VS = 0 V, RS = 0 Ω, CL = 1 nF,
Test Circuit 7
Off Isolation
–60
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz,
Test Circuit 8
Channel-to-Channel Crosstalk
–65
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz,
Test Circuit 10
Bandwidth –3 dB
530
MHz typ
RL = 50 Ω, CL = 5 pF, Test Circuit 9
CS (OFF)
5
pF typ
f = 1 MHz
CD (OFF)
8
pF typ
f = 1 MHz
CD, CS (ON)
8
pF typ
f = 1 MHz
POWER REQUIREMENTS
VDD = 5.5 V
Digital Inputs = 0 V or 5.5 V
IDD
0.001
µA typ
1.0
µA max
NOTES
1Y Version Temperature Range: –40°C to +125°C
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
REV. 0
–3–
ADG636
(VDD = 3 V 10%, VSS = 0 V, GND = 0 V. All specifications –40C to +125C unless otherwise noted.) SINGLE SUPPLY1
–40C to
–40C to
Parameter
+25C
+85C
+125C
Unit
Test Conditions/Comments
ANALOG SWITCH
Analog Signal Range
0 V to VDD
V
VDD = 2.7 V, VSS = 0 V
On Resistance (RON)
380
420
460
Ω typ
VS = 1.5 V, IS = –1 mA, Test Circuit 1
On Resistance Match Between
Channels (∆RON)
5
Ω typ
VS = 1.5 V, IS = –1 mA
LEAKAGE CURRENTS
VDD = 3.3 V
Source OFF Leakage IS (OFF)
±0.01
nA typ
VS = 1 V/3 V, VD = 3 V/1 V,
±0.1
±0.25
±2
nA max
Test Circuit 2
Drain OFF Leakage ID (OFF)
±0.01
nA typ
VS = 1 V/3 V, VD = 3 V/1 V,
±0.1
±0.25
±2
nA max
Test Circuit 2
Channel ON Leakage ID, IS (ON)
±0.01
nA typ
VS = VD = 1 V/3 V,
±0.1
±0.25
±6
nA max
Test Circuit 3
DIGITAL INPUTS
Input High Voltage, VINH
2.0
V min
Input Low Voltage, VINL
0.8
V max
Input Current
IINL or IINH
0.005
µA typ
VIN = VINL or VINH
±0.1
µA max
CIN, Digital Input Capacitance
2
pF typ
DYNAMIC CHARACTERISTICS2
Transition Time
170
ns typ
VS1A = 2 V, VS1B = 0 V, RL = 300 Ω,
320
390
450
ns max
CL = 35 pF, Test Circuit 4
tON Enable
250
ns typ
RL = 300 Ω, CL = 35 pF
360
460
530
ns max
VS = 2 V, Test Circuit 6
tOFF Enable
110
ns typ
RL = 300 Ω, CL = 35 pF
175
205
230
ns max
VS = 2 V, Test Circuit 6
Break-Before-Make Time Delay, tBBM
80
ns typ
RL = 300 Ω, CL = 35 pF,
10
ns min
VS1 = 2 V, Test Circuit 5
Charge Injection
0.6
pC typ
VS = 0 V, RS = 0 Ω, CL = 1 nF,
Test Circuit 7
Off Isolation
–60
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz,
Test Circuit 8
Channel-to-Channel Crosstalk
–65
dB typ
RL = 50 Ω, CL = 5 pF, f = 10 MHz,
Test Circuit 10
Bandwidth –3 dB
530
MHz typ
RL = 50 Ω, CL = 5 pF, Test Circuit 9
CS (OFF)
5
pF typ
f = 1 MHz
CD (OFF)
8
pF typ
f = 1 MHz
CD, CS (ON)
8
pF typ
f = 1 MHz
POWER REQUIREMENTS
VDD = 3.3 V
Digital Inputs = 0 V or 3.3 V
IDD
0.001
µA typ
1.0
µA max
NOTES
1Y Version Temperature Range: –40°C to +125°C
2Guaranteed by design, not subject to production test.
Specifications subject to change without notice.
–4–
REV. 0
ADG636
ABSOLUTE MAXIMUM RATINGS1
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
(TA = 25°C unless otherwise noted)
TSSOP Package
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . 150°C/W
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6.5 V
θJC Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 27°C/W
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –6.5 V
Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300°C
Analog Inputs2 . . . . . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . 220°C
Digital Inputs2 . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First
NOTES
1
Peak Current, S or D
Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation (Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . 20 mA of the device at these or any other conditions above those listed in the operational Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 10 mA sections of this specification is not implied. Exposure to absolute maximum rating Operating Temperature Range
conditions for extended periods may affect device reliability. Only one absolute Automotive (Y Version) . . . . . . . . . . . . . . –40°C to +125°C
maximum rating may be applied at any one time.
2
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Overvoltages at EN, A0, A1, S, or D will be clamped by internal diodes. Current should be limited to the maximum ratings given.
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG636YRU
–40°C to +125°C
Thin Shrink Small Outline (TSSOP)
RU-14
PIN CONFIGURATION
Table I. Truth Table
A1
A0
EN
ON Switch
A0
1
14 A1
X
X
0
NONE
EN
2
13 GND
0
0
1
S1A, S2A
ADG636
VSS 3
12 VDD
0
1
1
S1B, S2A
TOP VIEW
S1A
4
11 S2A
(Not To Scale)
1
0
1
S1A, S2B
S1B
5
10 S2B
1
1
1
S1B, S2B
D1
6
9
D2
NC
7
8
NC
NC = NO CONNECT
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although WARNING!
the ADG636 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are ESD SENSITIVE DEVICE